HTC close to releasing its third Microsoft Smartphone
Editor, DigiTimes.com, Taipei [Friday 29 August 2003]
Rumors of an upgraded SPV Smartphone, made by High Tech Computer (HTC), coming soon for Orange appear to be confirmed with photographs floating around on the web this morning.
Sources in Taiwan stated that the handset is very similar to HTC’s second Microsoft Smartphone (codenamed Tanager, also dubbed the SPV e100), but has been upgraded with a built-in camera and Bluetooth. It also appears that the design is based on a Texas Instruments (TI) OMAP radio chip solution with a 100-120Mhz companion CPU.
Other HTC-made devices, such as Hewlett-Packard (HP) iPAQs, have used Bluetooth solutions by Zeevo, according to approval documentation from the Federal Communications Commission (FCC) website.
It is unknown if the OS is the updated Smartphone 2003 OS based on CE .NET 4.2, which is documented to have a better Bluetooth stack support. Smartphone 2002 OS does not have native Bluetooth support built-in because the driver profile (and royalty paid for) and country support was unclear to ODM manufacturers. Now with Microsoft setting the standard, the issue will become a non-issue within the next one to two product cycles.
Sources also addressed the fact that the new HTC smartphone device will probably have some trouble handling the latest MMS services, specifically in video clip MMS, since the processor speed is only 120MHz, and the modem has to compete with the CPU for shared memory.
Frame rate is expected to be only around 8fps, disappointing for both video MMS and other online content, such as video clip playbacks. In comparison, a standard iPAQ Pocket PC has around 18-20fps or even faster frame rate, depending on the CPU.
Dimensions of the new smartphone are expected to be similar to HTC’s Tanager smartphone at 116×46×22mm. In comparison, Sony Ericsson P800 measures at 117×59×27mm. The trend is towards thinner models. It is estimated that the mainstream dimension for a candy bar handset will be within 105×44×19-20 mm, beginning in the fourth quarter of this year. Some new handsets from Japan are as thin as 16mm. The second-generation Mitac International clamshell, XScale-powered Smartphone is rumored to be 19mm.
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